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Material science

Material

2D / 3D nano
Quantum dot materials
QD LED chip

Software

Embedded GPU
Image multiplexing

Drive

Micro led special control
IC, drive IC

Application

Micro spacing
LED display technology

Packaging technology

Admixture on board hybrid packaging technology

Using semiconductor automation equipment and on-board packaging technology, the lamp beads are completely sealed in the protective layer, which is waterproof, dustproof and anti-collision, and greatly improves the reliability of the screen.

Technology of coating packaging Bi-layer on Board(BoB)

The micro spacing panel technology avoids the crosstalk interference between adjacent lamp plates, has stable and reliable performance, and the protection grade of LED panel surface is above IP65;With ultra-high contrast and ultra wide viewing angle, the light output effect is more uniform and soft, and the picture color is more real and full.

Solid crystal packaging technology on COB micro spacing board

Blue film sorting, transfer, full-color flip chip, bonding substrate with micro spacing, high precision and efficient mounting, process reliability of more than 4 9, accurate transfer bonding of 50 μ M or more, the chip has exquisite light emitting color, which can make the color performance of the screen have no color difference and high uniformity.

Standard Design

·An independent display unit matching the standard unit "inch".
·Each standard resolution is presented in different sizes and point spacing.
·With the same resolution, the control and driving architecture of the panel are exactly the same.

CONTACT

sales@aetled.com

+86 0769-38820268

9-10th Floor , 1st Building, E Zone, Guangda We Valley, 4th Keji Road, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province,China

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